EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA
The AX-8200 machine is designed to provide high resolution x-ray
imaging primarily for the electronics industry. This versatile
system is effective for many applications within the PCB
manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB
and the wide range of SMT components. The AX-8200 is a powerful
support tool for process development, process monitoring and
refinement of the rework operation. Supported by a powerful and
easy to use software interface, the AX-8200 is capable of
addressing small and large volume factory requirements. (Contact us
● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD
● Motion controls include: ±60° tilt motion, X/Y table motion plus
Z axis tube and detector movement.
● Multi-function DXI image processing system
● X/Y programming function for multiple image inspection routines
● Max. loading area 510mm x 420mm, max. detection area 435 x 385mm
with ~300X System Magnification.
BGA void/area auto-measurement plus report generation.
BGA , CSP , LED , Flip Chip , Semiconductor,
Battery Industry , Small Metal Casting,
Electronic Connector Module,
Aerospace Components , Photovoltaic Industry,
Other Special Industries.
510mm x 420mm
435mm x 385mm